TSMC

Taiwanese semiconductor foundry company

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2024 Projected opening of Fab 21 phase 1 in Phoenix, Arizona for 300 mm wafer production.
December 2024 TSMC's first factory (Fab 23) in Kikuyo, Kumamoto began commercial operations, producing 12-, 22-, and 28-nanometer processes. The factory cost US$8.6 billion, with 476 billion yen subsidized by the Ministry of Economy, Trade and Industry (METI).
October 2024 Revealed development plans for Halo Vista, a 3,500-acre mixed-use development around TSMC plants, including the Sonoran Oasis Research and Technology Park, with potential for up to 6 fabrication plants worth approximately $120 billion.
October 2024 TSMC informed the US Department of Commerce about a potential breach of export controls involving an advanced chip sent to Huawei.
June 2024 C. C. Wei transitioned to become the Chairman of TSMC, marking a significant leadership change for the company.
April 2024 The US Commerce Department agreed to provide $6.6 billion in direct funding and up to $5 billion in loans to TSMC for semiconductor manufacturing facilities in Arizona under the CHIPS and Science Act.
February 2024 TSMC shares hit a record high, with the trading day reaching NT$709 and closing at NT$697, influenced by an increase in Nvidia's price target.
January 2024 TSMC chairman Liu warned that Arizona lacks workers with specialized skills, suggesting the second Arizona plant might not start advanced chip production until 2027 or 2028.
January 2024 As of early 2024, TSMC's ownership structure reveals a diverse shareholder base, with approximately 56% of shares held by the general public and 38% by institutions. The National Development Fund, Executive Yuan is the largest shareholder, owning 6.38% of the company's shares.
August 2023 TSMC committed €3.5 billion to establish a semiconductor factory in Dresden, Germany, forming a joint venture with Robert Bosch GmbH, Infineon Technologies, and NXP Semiconductors. The European Semiconductor Manufacturing Company (ESMC) is planned to have a monthly capacity of 40,000 12-inch wafers and become fully operational by 2029.
July 2023 TSMC warned that US talent was insufficient for the chip factory, indicating Taiwanese workers would need to be brought in, and pushed back the operational timeline to 2025.
December 2022 TSMC announced plans to triple its investment in Arizona plants in response to US-China tensions and global chip shortages, while also acknowledging significant cost challenges in US manufacturing.
October 2022 Began volume production of 3 nm process technology in Q4.
July 2022 TSMC announced a record profit in the second quarter, with net income up 76.4 percent year-over-year.
February 2022 Denso took a more than 10 percent equity stake in JASM with a US$0.35 billion investment, and TSMC agreed to enhance the subsidiary's manufacturing capabilities.
2021 TSMC began an eight-year, $12 billion investment project for the Arizona semiconductor manufacturing facility.
2021 TSMC improved its ranking to third in the MEMS field.
November 2021 TSMC and Sony announced the establishment of Japan Advanced Semiconductor Manufacturing (JASM) in Kumamoto, Japan, with an initial investment of approximately $7 billion.
July 2021 Apple and Intel reported to be testing proprietary chip designs using TSMC's 3 nm production technology.
July 2021 TSMC and Foxconn reached an agreement to purchase 10 million BioNTech COVID-19 vaccines, pledging to buy five million doses each.
June 2021 TSMC and Foxconn were allowed to jointly negotiate purchasing COVID-19 vaccines for Taiwan.
January 2021 Started risk production of 4 nm process technology.
2020 TSMC became the first semiconductor company to sign the RE100 initiative, pledging to use 100 percent renewable energy by 2050.
November 2020 Officials in Phoenix, Arizona approved TSMC's plan to build a $12 billion chip plant in the city.
July 2020 Signed a landmark 20-year deal with Ørsted to purchase the entire production of two offshore wind farms in Taiwan, which was the world's largest corporate green energy order at the time.
July 2020 TSMC confirmed it would halt shipments of silicon wafers to Huawei and HiSilicon by September 14.
January 2020 Started risk production of 6 nm process technology in Q1.
2019 TSMC was ranked fourth in the MEMS (Micro-Electro-Mechanical Systems) field, behind leader Silex Microsystems.
January 2019 Began advertising N7+, N7, and N6 as leading edge semiconductor technologies.
2018 Morris Chang retired after 31 years of leadership. Mark Liu became chairman and C. C. Wei became Chief Executive.
June 2018 C. C. Wei became the sole Chief Executive Officer of TSMC, succeeding the co-CEO model.
March 2017 TSMC invested US$3 billion in Nanjing to develop a manufacturing subsidiary, despite objections from the Tsai Ing-wen administration.
2014 TSMC was at the forefront of the foundry industry for high-performance, low-power applications, leading major smartphone chip companies like Qualcomm, Mediatek, and Apple to increase their orders.
October 2014 TSMC's monthly sales peaked, followed by a 10 percent decrease in November due to cautious inventory adjustments by customers.
August 2014 TSMC's production capacity for the fourth quarter was almost fully booked, a rare occurrence attributed to landing CPU orders from Apple.
August 2014 TSMC's board of directors approved additional capital appropriations of US$3.05 billion for further expansion.
May 2014 TSMC's board of directors approved capital appropriations of US$568 million to increase and improve manufacturing capabilities.
March 2014 TSMC raised its financial guidance and posted 'unseasonably strong' first-quarter results, driven by increased demand for smartphone application chips.
2013 C. C. Wei and Mark Liu became co-CEOs of TSMC, leading the company together.
2011 TSMC began trial production of A5 and A6 SoCs for Apple's iPad and iPhone devices, and planned to increase research and development expenditures by 39 percent to NT$50 billion.
2011 TSMC planned to increase research and development expenditures by 39% to NT$50 billion and expand manufacturing capacity by 30% to compete in the semiconductor market.

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